Electronics
Specialty additives and functional fillers for protection, thermal management, lightweighting, adhesion, surface control and reliability of electronic assemblies.
THE BRIEF
Reliability engineering, not commodity supply.
Every electronic assembly is a balancing act — protection against weight, heat dissipation against electrical insulation, adhesion against flexibility, coverage against cost. Geocon supplies the additive classes that PCB manufacturers, potting compounders and encapsulation formulators reach for when one side of that balance needs correcting.
From conformal coatings and potting compounds to thermal interface materials, EV battery encapsulation and antimicrobial housings — our range covers the assembly from the bare board to the finished, in-service device.
"Geocon Products offers specialty additives and functional fillers for protection, thermal management, lightweighting, adhesion, surface control and reliability of electronic assemblies."
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Product Families0
Application areas mapped<24h
Technical Data TurnaroundISO
Batch-Tested ConsistencyTwenty-four ways the bench shows up inside a device.
Read left to right the way an application engineer would: what's being built, which Geocon products get specified, and what job they're doing in the formulation.
| Electronics Application | Geocon Product(s) | Function & Benefit |
|---|---|---|
| Conformal coatings for PCBs |
PFA-Free Coating Fluorosurfactants Super-Wetting Agents |
Improves coating coverage around solder joints, leads and difficult PCB geometries; reduces pinholes, craters and uneven film at low dosage. |
| Moisture- & water-repellent PCB coatings | Fluorinated / PFA-Free Repellents | Resistance against humidity, condensation, water splashes and contamination on PCBs, sensors and assemblies. |
| Potting & encapsulation compounds |
Hollow Glass Microspheres Ceramic Microspheres Defoamers Adhesion Promoters |
Used in epoxy, polyurethane and silicone potting to reduce density, improve flow, lower material use and reduce stress on delicate components. |
| Lightweight electronic housings |
Glass Bubbles Ceramic Microspheres |
Reduces weight of polymer housings for chargers, battery systems, control units, electrical boxes and portable devices. |
| Thermally conductive, insulating compounds | Hexagonal Boron Nitride | Thermal gap fillers, encapsulants, thermally conductive adhesives, heat-dissipation coatings and polymer compounds. |
| LED thermal management | Hexagonal Boron Nitride | Suitable for LED encapsulation compounds, thermally conductive plastics, heat-sink interfaces and LED housings. |
| Power electronics & inverter modules |
Boron Nitride Adhesion Promoters Defoamers |
Electrically insulating thermal interface materials around power modules, transformers, inverters and semiconductor assemblies. |
| Thermal interface adhesives |
Boron Nitride Silane Adhesion Promoters |
Improves heat transfer and bonding between components, heat sinks, ceramic substrates and aluminium housings. |
| Epoxy moulding compounds |
Boron Nitride Glass Microspheres Milled Glass Fibres Defoamers |
Encapsulation of semiconductors, coils, relays and connectors requiring dimensional stability, controlled shrinkage and thermal performance. |
| Electronic adhesives & sealants |
Silane Adhesion Promoters Wetting Agents Defoamers |
Improves bonding of epoxy, polyurethane, silicone and hybrid adhesives to metals, glass, ceramics and plastics. |
| PCB solder-mask & protective coatings |
Super-Wetting Agents Fluorosurfactants Silicone-Free Defoamers |
Improves substrate wetting, levelling, film uniformity and air release while reducing craters and foam. |
| Electronic inks & functional coatings |
Wetting & Dispersion Additives Fluorosurfactants Defoamers |
Suitable for conductive, dielectric and protective inks, sensor coatings and screen-printing formulations needing uniform, smooth deposition. |
| Touchscreen & display coatings |
PFA-Free Super-Wetting Agents Stain-Resistant Additives |
Protective coatings for glass displays and touch surfaces improving levelling and resistance to fingerprints, oils and stains. |
| Battery-pack coatings & sealants |
Boron Nitride Glass Bubbles Adhesion Promoters |
Potential use in potting, thermal barriers, lightweight encapsulation, housing compounds and protective coatings. |
| EV battery thermal barriers |
Glass Bubbles Ceramic Microspheres Boron Nitride |
Glass and ceramic microspheres suit lightweight thermal-barrier coatings; Boron Nitride where controlled heat dissipation is required. |
| Electrical insulation coatings |
Boron Nitride Ceramic Fillers Adhesion Promoters |
Used in insulating varnishes and coatings for motors, transformers, coils, busbars and electrical assemblies. |
| Transformer & coil encapsulation |
Glass Bubbles Boron Nitride Defoamers |
Glass bubbles reduce density and cost; Boron Nitride supports heat dissipation; defoamers prevent air pockets that weaken insulation. |
| EMI-shielding compounds |
Milled Glass Fibres Wetting & Dispersion Additives |
Reinforces polymer housings and aids dispersion of conductive fillers such as silver, nickel, carbon or graphite. |
| Connectors, switches & electrical components |
Milled Glass Fibres Glass Bubbles Adhesion Promoters |
Used in engineering plastics and thermoset compounds for strength, dimensional stability, weight reduction and surface bonding. |
| Camera, sensor & optical-module protection |
Conformal Coatings Hydrophobic Additives Super-Wetting Agents |
Thin protective coatings guard sensors and modules from moisture and contamination, subject to optical-transmission requirements. |
| Solar & photovoltaic electronics |
Adhesion Promoters Conformal Coatings Defoamers Wetting Agents |
Suitable for junction-box adhesives, protective coatings, backsheet coatings, sealants and encapsulation systems. |
| Telecommunication equipment |
Conformal Coatings Boron Nitride Glass Bubbles |
Outdoor circuit protection, antenna electronics, base-station modules, power supplies and thermal-management compounds. |
| Consumer-appliance electronics |
Conformal Coatings Antimicrobial Additives Thermal Fillers |
Control boards, touch panels, switches and housings for refrigerators, washing machines, ACs and kitchen appliances. |
| Antimicrobial electronic surfaces |
Silver Zeolite Silver Zirconium Phosphate Nano-Zinc Oxide Antimicrobial Silanes |
Suitable for frequently touched surfaces — switches, control panels, keyboards, appliance panels and healthcare electronics. |
Eight additives. Every one earns its place in the assembly.
Each panel is read like a materials datasheet: by physical form, by function, and by where it's best positioned across the electronics stack.
Hexagonal Boron Nitride
A thermally conductive but electrically insulating platelet filler for thermal interface materials, LED heat-dissipation and power-electronics encapsulation.
3M Hollow Glass Microspheres
Lightweight, low-density spheres for epoxy and polyurethane potting, low-density housings and thermal-barrier coatings. High-strength grades available where processing shear matters.
PFA-Free Conformal Coatings
Moisture protection, water repellency and contamination resistance in a thin film — with ambient or low-temperature cure and reduced dependence on conventional PFAS chemistries.
Fluorosurfactants & Super-Wetting Agents
Lowers surface tension for better substrate wetting, edge coverage and levelling — reducing craters and pinholes in conformal coatings, solder masks and electronic inks.
Adhesion Promoters
Epoxy- and amino-functional silanes that improve adhesion between inorganic surfaces and organic polymers — aluminium, copper, stainless steel, glass, ceramics and engineering plastics.
Silicone & Silicone-Free Defoamers
Prevents entrapped air, pinholes, voids and insulation defects in epoxy potting, polyurethane encapsulation, waterborne conformal coatings and battery coatings.
Milled Glass Fibres
Reinforces electronic housings, connectors and switchgear components — improving strength, dimensional stability and performance in high-temperature engineering plastics.
Antimicrobial Additives
Silver zeolite, silver zirconium phosphate, nano-zinc oxide and antimicrobial silanes for frequently touched surfaces — switches, control panels, keyboards and healthcare electronics.
The most promising electronics segments.
PCB Conformal & Protective Coatings
Epoxy & Polyurethane Potting Compounds
LED Thermal-Management Materials
EV Battery & Power-Electronics Materials
Electronic Adhesives & Sealants
Electronic Inks & Solder-Mask Formulations
Lightweight Electrical & Electronic Housings
Antimicrobial Coatings for Electronic Surfaces
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