NEXABOR™
Thermal Management Fillers
High-purity Hexagonal Boron Nitride (h-BN) and Silicon Nitride (Si3N4) functional micro-powders engineered for extreme heat dissipation, high dielectric breakdown strength, and low thermal expansion in modern electronic packaging, TIMs, and EV power modules.
Technical Mandate: Next-generation silicon carbide (SiC) and gallium nitride (GaN) semiconductors, EV traction inverters, and high-frequency 5G electronics require rapid heat transfer while maintaining strict electrical isolation. NEXABOR™ Boron Nitride and Silicon Nitride fillers bridge the gap between high thermal conductivity and high dielectric strength.
NEXABOR™
FUNCTIONAL FILLER SERIES
Select a specialized NEXABOR™ ceramic filler product below to review morphology options, dielectric strengths, and targeted thermal interface formulations.
NEXABOR™ fillers introduce superior thermal conduction pathways across polymer matrices without causing electrical short circuits or Signal leakage in high-frequency circuits.
High Dielectric Strength
Breakdown voltages exceeding 30 kV/mm allow close spacing between high-power semiconductors and cooling plates.
Extreme Thermal Transport
Hexagonal Boron Nitride offers theoretical in-plane thermal conductivity up to 300 W/m·K for fast heat removal.
Thermal Shock Immunity
Silicon Nitride (Si3N4) provides low thermal expansion coefficients, matching silicon and SiC chip expansion profiles.
Chemical & Molten Inertness
Resists chemical attack by acids, solvents, and molten non-ferrous metals at temperatures well above 1000°C.
Low Rheological Impact
Spherical BN and surface-treated Si3N4 variants allow high volumetric filler loadings while preserving resin pourability.
Low Dielectric Loss (Df)
Minimizes signal attenuation in 5G mmWave antennas, high-frequency radar housings, and RF substrates.
Key implementation sectors for NEXABOR™ Boron Nitride and Silicon Nitride specialized ceramic powders.
EV Traction Inverters & Power Modules
High-dielectric gap pads and phase-change materials for SiC power modules, traction inverters, and EV fast-charging station thermal heat sinks.
5G Communications & Consumer Electronics
Thermal greases, underfill resins, and CPU/GPU heat spreader pads in smartphones, 5G base station antennas, and server blade cooling systems.
AMB & DBC Ceramic Substrates
Submicron Silicon Nitride (Si3N4) for Active Metal Brazing (AMB) substrate manufacture, delivering high mechanical flexural strength under severe temperature cycling.
High-Temperature Lubricants & Coatings
Hexagonal Boron Nitride coatings for molten aluminum release agents, glass forming molds, and high-temperature vacuum furnace lubricants.
| Property Metric | NEXABOR™ BN-Platelets (h-BN) | NEXABOR™ BN-Spheres (h-BN) | NEXABOR™ SN-Submicron (Si3N4) |
|---|---|---|---|
| Chemical Formula | Hexagonal Boron Nitride | Hexagonal Boron Nitride | Alpha Silicon Nitride (Si3N4) |
| Particle Geometry | Platy / Flake-like | Agglomerated Spheres | Equiaxed Submicron Grains |
| Thermal Conductivity | 300 W/m·K (In-Plane) | Isotropic (Orientation Independent) | 90 – 120 W/m·K (Sintered) |
| Electrical Resistivity | > 10^14 Ω·cm | > 10^14 Ω·cm | > 10^12 Ω·cm |
| Dielectric Strength | 35 kV/mm | 30 kV/mm | 25 kV/mm |
| Max Service Temp (Air) | 900°C (Oxidizes above 900°C) | 900°C | 1400°C |
| Key Specialty Role | TIM Pads & Dry Lubricants | Underfills & Liquid Resins | AMB Substrates & Structural Parts |
NEXABOR™ ceramic powders are synthesized under controlled high-temperature nitridation processes to ensure extremely low metallic impurity counts (Fe, Ca, Na < 100 ppm), safeguarding sensitive electronic circuits against galvanic degradation.
REACH & RoHS Compliant
Completely free of heavy metals, halogenated flame retardants, and restricted hazardous substances.
Low Ionic Impurity Levels
Rigidly controlled water-soluble chloride and sodium ions maintain low electrical conductivity in aqueous environments.
Morphology & Product Gallery
Examine physical powder appearance, microscopic particle alignment, and high-heat dissipate fields.
Pristine Powder State
Ultra-pure, silky h-BN powder providing exceptional lubricity and thermal transport.
Microscopic Platelet Geometry
Scanning electron microscopy showing well-crystallized hexagonal ceramic grain structures.
TIM Gap Filler Integration
Silicones and epoxies loaded with NEXABOR™ BN for efficient semiconductor cooling.
Frequently Asked
Questions (FAQ)
Get quick, technically vetted answers regarding thermal conductivity mechanisms, electrical isolation, and resin loading of NEXABOR™ fillers.
Geocon Group — Advanced Ceramics & Thermal Management Division
Geocon Group manufactures and distributes NEXABOR™ Boron Nitride and Silicon Nitride materials. We provide particle size distribution customization, surface functionalization, laboratory thermal conductivity profiling, and trial sample dispatch from our corporate lab in Navi Mumbai.
NEXABOR™ Applications at a Glance
Discover how NEXABOR™ ceramic fillers resolve thermal bottlenecks across automotive, semiconductor, energy, and aerospace engineering platforms.
Automotive & EV Power
Potting compounds for EV battery packs, SiC traction inverters, onboard chargers, and thermal gap pads.
AMB & Substrate Circuits
Submicron Silicon Nitride powders for high-strength AMB ceramic substrates and flip-chip underfill resins.
5G Telecom & Hardware
Low dielectric loss (Df) thermal pastes for 5G mmWave antennas, optical transceivers, and AI server chips.
High-Temp Release & Coatings
Molten non-ferrous metal release sprays, glass molding lubricants, and vacuum sintering furnace coatings.
Aerospace & Radar Enclosures
Radar-transparent thermal insulation composites, jet engine sensor potting, and high-shock ceramic parts.
Photovoltaic & Energy Storage
Thermally conductive backsheet coatings for solar panels and energy storage system (ESS) cooling plates.
NEXABOR™ Batches
Connect with our Navi Mumbai technical desk to select optimal BN/Si3N4 particle distributions, request technical datasheets (TDS), or arrange sample allocations for laboratory compounding trials.
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Call: +91 97695 93030
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Email Us
support@geoconproducts.com