Boron Nitride
Cooling Fillers
White Graphite for Advanced Thermal Management
High-purity hexagonal Boron Nitride (h-BN) fillers and coatings — the only material that delivers exceptional thermal conductivity up to 300 W/m·K while maintaining perfect electrical insulation. The cooling filler of choice for electronics, EV batteries, LED lighting, foundry operations, and next-generation thermal interface materials.
Precision Thermal Management withBoron Nitride Cooling Fillers
Also known as White Graphite, hexagonal Boron Nitride (h-BN) is a unique advanced material that combines the thermal conductivity of graphite with the electrical insulation of a ceramic — making it the ideal cooling filler for the world's most heat-sensitive applications.Why Boron Nitride Is Called "White Graphite" — Like graphite, h-BN has a layered hexagonal crystal structure with weak van der Waals forces between layers, giving it exceptional lubricity and thermal conductivity in the plane of the platelets. But unlike graphite, Boron Nitride is an electrical insulator — not a conductor. This combination of high thermal conductivity (up to 300 W/m·K in-plane) + high dielectric strength is unmatched by any other filler material, making it the first-choice thermal management additive for applications where heat must be moved away from sensitive electronic components without creating electrical short circuits.
Engineered for Modern Thermal Challenges — As electronic devices shrink, power densities increase, and EV battery packs demand faster cooling, the need for thermally conductive but electrically insulating fillers has never been greater. NEXACOOL Boron Nitride Cooling Fillers from Geocon Products are available in 8 powder grades (1–200 µm) and 2 coating grades, each engineered for specific thermal management, lubrication, release, and protection applications across electronics, automotive, foundry, cosmetics, and advanced manufacturing sectors.
Boron Nitride Powders & Coatings
4 powder grades from ultra-fine to extra-coarse, plus 2 ready-to-apply water-based BN coatings — covering every thermal management, lubrication, and release application.
Boron Nitride Powders
4 Grades · 1–200 µmGPBN-1005
Ultra-fine h-BN powder for advanced thermal interface materials, thin-film coatings, and high-surface-area dispersion applications requiring maximum contact area and thermal transfer.
GPBN-1015
Fine h-BN powder offering balanced thermal conductivity, superior surface slip, and consistent dispersion. Ideal for thermal greases, potting compounds, and polymer compounds.
GPBN-3010
Coarse h-BN powder for high thermal conduction, high-temperature stability, and superior lubricity. Larger particle structure delivers excellent heat dissipation and reduced friction in demanding environments.
GPBN-10015
Extra-coarse h-BN for extreme thermal and tribological performance. Robust particle structure provides exceptional heat dissipation, outstanding high-temperature stability, and superior dry lubricity.
Boron Nitride Coatings
2 Grades · Water-BasedGPBN-WB
Premium water-based BN coating (20–30% h-BN in alumina binder) for non-wetting, high-temperature release, and superior lubrication on metal, ceramic, and graphite substrates. White colour. Max use 850°C.
GPBN-BL
Blue-coloured high-performance BN coating with strong alumina binder for excellent non-wetting, high-temperature lubrication, and clean-release on metal, graphite, and ceramic substrates. Max use 1370°C.
12 Industries Where White Graphite Delivers
From thermal interface materials in smartphones to molten metal release coatings in foundries — Boron Nitride's unique thermal + insulating + lubricating + inert properties make it the most versatile advanced filler in modern manufacturing.
Thermally Conductive Plastics & Elastomers
Improve cooling in LEDs, EV components, sensors, and electronic housings. Boosts k-value without adding electrical conductivity.
Thermal Interface Materials (TIMs)
Stable, high-performance thermal greases, pads, and adhesives with superior heat dissipation for CPU, GPU, power electronics.
Encapsulants & Potting Compounds
Protect sensitive circuits and power modules from overheating and electrical stress. Ideal for LED driver and EV controller potting.
Battery & EV Cooling Systems
Enhance thermal diffusion and safety in lithium-ion battery packs, BMS modules, and IGBT power control units.
Release Agents & Anti-Stick Coatings
Non-wetting to Al/Mg/Zn melts. Superb lubricity for casting dies, glass forming, rubber demoulding, and foundry mold wash.
Dry Lubricants (High-Temp / Clean)
Graphite-like slip but non-carbon — works in vacuum, oxidising atmospheres. Aerospace mechanisms, oven chains, metal forming.
Refractory Coatings & Crucibles
Thermal shock resistance, oxidation resistance, non-wetting. BN-coated ladles, crucibles for Al/Mg melts, foundry mold wash.
Ceramic Composites & Sintered Bodies
Low dielectric loss, machinability, thermal stability. Microwave components, RF fixtures, insulator rings.
Electronics Substrates & 2D Materials
Atomically smooth, wide bandgap dielectric. h-BN substrate and encapsulation for graphene/MoS₂ devices (R&D).
Cosmetics & Personal Care
Silky slip, soft-focus matte feel, oil absorption, brilliant whiteness. Primers, powders, lipsticks, sunscreens.
Paints & Industrial Coatings
Lubricity + heat dissipation + anti-stick on hot tooling. BN in high-temp coatings for welding nozzles, moulds.
Oil & Gas / Machining Fluids
Reduces friction and wear under extreme pressure and heat. Chemically inert EP lubricant additive for thread-making, valves.
BN Cooling Fillers vs Competing Materials
How NEXACOOL Boron Nitride outperforms traditional thermal fillers across the key parameters that matter to formulators — thermal conductivity, electrical insulation, weight, processability, and chemical stability.
vs Silica (SiO₂)
Economical but low thermal conductivity. BN offers up to 20× better heat transfer and smoother finish.
vs Alumina (Al₂O₃)
Hard and abrasive ceramic. BN gives similar thermal performance with lighter weight and easier processing.
vs Aluminium Nitride (AlN)
High thermal conductor but costly and moisture-sensitive. BN provides balanced performance with better stability.
vs Graphite
Excellent heat conductor but electrically conductive. BN transfers heat while remaining a perfect insulator.
vs Graphene / CNTs
Very high conductivity but expensive and difficult to disperse. BN achieves uniform dispersion and insulation.
vs Carbon Black
Adds colour and electrical conductivity. BN adds heat management, lubrication, and reflectivity instead.
vs Mica
Good barrier properties. BN adds superior lubricity, higher thermal conductivity, and high-temperature stability.
vs Magnesium Oxide (MgO)
Decent conductor but reactive and hygroscopic. BN is inert, non-hygroscopic, and process-friendly.
vs Silicon Nitride (Si₃N₄)
Mechanically strong but dense. BN provides similar durability at lower weight and easier dispersion.
vs Metallic Powders (Al, Cu)
Great heat conductors but electrically active and oxidising. BN delivers non-conductive, corrosion-free cooling.
NEXACOOL Product Data Tables
Boron Nitride Powders — Full Grade Comparison
| Grade | Purity (B+N) | Oxygen | Carbon | B₂O₃ | Metallic Imp. | Particle Size | BET | Shape |
|---|---|---|---|---|---|---|---|---|
| GPBN-1300 | >99% | ~0.5% | ~0.05% | <0.3% | <0.2% | 1–3 µm | 6–8 m²/g | Hex. Platelets |
| GPBN-4800 | >99% | ~0.4% | ~0.05% | <0.25% | <0.2% | 4–8 µm | 3–8 m²/g | Hex. Platelets |
| GPBN-1013 | >99% | ~0.6% | ~0.05% | <0.3% | ~0.18% | 10–13 µm | 2–7 m²/g | Hex. Platelets |
| GPBN-1520 | >99% | ~0.3% | ~0.03% | <0.3% | ~0.2% | 15–20 µm | 2–5 m²/g | Hex. Platelets |
| GPBN-2830 | >99% | ~0.4% | ~0.03% | <0.3% | ~0.2% | 28–30 µm | 2–5 m²/g | Hex. Platelets |
| GPBN-3010 | >99% | ~0.22% | ~0.01% | <0.05% | <0.1% | 30–100 µm | 3–4 m²/g | Hex. Flakes |
| GPBN-10150 | >99% | ~0.47% | ~0.01% | <0.05% | <0.1% | 100–150 µm | 2–3 m²/g | Hex. Flakes |
| GPBN-7090 | >98.5% | ~1% | ~0.03% | <0.5% | <0.2% | 7–9 µm | 3–7 m²/g | Hex. Platelets |
Boron Nitride Coatings — Grade Comparison
| Grade | Colour | BN % | Carrier | Binder | pH | Viscosity (cps) | Sp. Gravity | Max Temp (°C) |
|---|---|---|---|---|---|---|---|---|
| GPBN-WB | White | 20–30% | Water | Alumina | 5.5–8.0 | 10,000–20,000 | 1.2 | 850 |
| GPBN-BL | Blue | 20–30% | Water | Alumina | 5.5–8.0 | 10,000–20,000 | 1.2 | 1370 |
NEXABOR™ Batches
Connect with our Navi Mumbai technical desk to select optimal BN/Si3N4 particle distributions, request technical datasheets (TDS), or arrange sample allocations for laboratory compounding trials.
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